SCCM Packaging Engineer | Install Shield & Admin Studio
Ben Edictio Search Manila
Job Description
This is direct hire - permanent role to our client.
Salary offer depends on your experiences and skills. Your salary expectation will still undergo approval of our client.
Specific Job title/Position: SCCM Packaging EngineerWork Set up: Hybrid- 3x onsite/ week in Two E-com, Pasay
Schedule: Rotating shift depending on business needs: 2 shifts (morning & night shiftting);- Weekends off, skeletal schedule during Holidays
- Graduate of Bachelor's Degree in IT or related course
- • 3 years relevant experience working with SCCM
- 1+ Service Now or equivalent ticketing system experience
- 2 to 3 years of experience in using AdminStudio/ Install Shield
- Knowledge and experience in AdminStudio. Must know how to package applications from loose files, NOT set-up capture.
- Can create MSI package from scratch
- Knowledge in deploying SCCM
- SQL and Wise scripting is a plus
- Must be able to communicate technical concepts clearly to a wide audience
- Demonstrate a customer focused attitude.
- SCCM Feature Knowledge (Applications, packages, baselines, global conditions, task sequences, queries)
- Microsoft Active Directory Administration experience
- Security patching using SCCM with WSUS integration.
- Excellent English, oral and written, communication skills
- Can Start ASAP
CapgeminiManila
to reimagine what’s possible. Join us and help the world’s leading organizations unlock the value of technology and build a more sustainable, more inclusive world.
Job Description
Job Responsibilities:
• Package software using AdminStudio, WiseScript, Batch...
Ben Edictio SearchQuezon City, 10 km from Manila
Job Description
This is direct hire - permanent role to our client.
Salary offer depends on your experiences and skills. Your salary expectation will still undergo approval of our client.
Specific Job title/Position: SCCM Packaging Engineer
Work...
Power IntegrationsPasig, 11 km from Manila
Science
• Minimum15 years of experience in Semiconductor Assembly as Process Engineer, Process Development Engineer & Package Development Engineer : Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and DTFS & Package Singulation...